The MECHANIC XG50 PPD Solder Paste (35 g) is engineered for professional-grade PCB and BGA repair operations. With a melting point of 183 °C, this solder paste ensures robust solder joints, excellent conductivity, and smooth flow—making it the perfect choice for detailed electronics repair tasks.

Key Features:

• Melting point: 183 °C for reliable flow and bonding

• Premium PPD (Pre-Placed Deposition) micro-paste formulation for high precision

• Ideal for BGA rework, mobile-board repair, and fine-pitch component soldering

• Smooth consistency, easy to apply thinly and evenly

• Enhances adhesion and reduces chances of cold joints or incomplete soldering

• Comes in a sealed 35 g container for multiple uses and enhanced freshness

• Designed for professionals: trusted in mobile-repair, motherboard rework, and demanding electronics environments

• Safety note: Use in a well-ventilated area, avoid ingestion/inhalation, store sealed and away from food.

Usage Instructions:

1. Clean the soldering area thoroughly to remove flux residues or oxidation.

2. Apply a thin, even layer of solder paste onto the PCB pad or BGA site.

3. Heat the area to ~183 °C until the paste flows and wets the joint properly.

4. Allow to cool and inspect joint integrity.

5. Keep the container sealed when not in use to maintain optimal performance.

Why Choose MECHANIC XG50?
For technicians and repair professionals working on delicate boards or BGAs, this solder paste offers consistent, high-quality results. Its 183 °C activation ensures reliable joint formation without excessive thermal stress, while the PPD formulation gives excellent control and reduced defects.