Description:
The RELIFE RL-403 PPD Solder Paste Injection – 183 °C is a professional-grade solder paste designed specifically for smartphone, PCB, BGA and motherboard rework applications. Formulated with Sn63/Pb37 alloy, this solder paste ensures reliable joints, excellent flow and consistent performance under rework conditions.

Key Features:

• Alloy Composition: Sn63 / Pb37 (63 % tin, 37 % lead) for excellent wetting and saturated flow. 

• Melting Point: 183 °C – optimal for standard mobile PCB repair and rework applications. 

• Particle Size: 20-38 µm — fine consistent particles suitable for injection and precise soldering work. 

• Viscosity: 160-230 Pa·s — designed for controlled dispensing and minimal sag in vertical reflow or hot-air rework. 

• Package: 10 cc (approx. 35 g) syringe-injection format – convenient for SMT/BGA repair. Ideal for: mobile phone motherboard repair, BGA ball re-balling, SMT pad rework, fine pitch device repair.

Usage Tips:

• Pre-heat substrate moderately before applying to improve flow and minimize voids.

• Use under controlled hot-air, infrared or reflow station set above 183 °C for best results.

• Store in cool, dry place; reseal syringe after use to preserve flux activity.

Package Contents:

• 1 × Solder Paste (RELIFE RL-403 PPD 10 cc)